> Remind me: Why do they not make 3D chips already?

They use lithography to put transistors onto the surface
of silicon wafers, commonly this required wiring from the
edges of the chips.

3D chips require interconections between layers of
of circuits. IBM has been producing some chips with
TSVs (through-silicon vias) to connect stacks of wafers.
There are some production issues, but it's almost to
the PC market.
http://www.semiconductor.net/article/CA6535050.html

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